M Noroozi - Assistant Professor, Faculty of Mechatronic, Karaj Islamic Azad University, Karaj, Alborz, Iran

Thin solid films have attracted great attention of many researchers in different fields due to their diverseapplications in science and technology including optical mirrors, semiconductors, gossamer space structures,stretchable electronics, solar cells, sensors and actuators and MEMS/NEMS. Thin films deposited on a substrate areused to improve the mechanical, thermal, electrical and tribological properties of the system. The functionality andreliability of the system is influenced by the mechanical stresses developed in the structure; so that the role of themechanical stresses in the appropriate functionality of the system, detaching the film from the substrate, or the fractureof the film is important. In order to escape the complexity of solving the coupled elasticity equations of the substrateand films (especially in multi-layer systems), a procedure is proposed in this work to find the stress and displacementfield in the film/films and the substrate. The procedure is based on the assumption that the substrate is dominant on thesystem (i.e. the displacement field); and the films-substrate interactions are imposed to modify the presumeddisplacement field. Therefore, by using an iterative process and meeting convergence criteria, one may find thedisplacement and stress field on the film-substrate system. The procedure is implemented for special case of a rotatingcylinder coated by a thin film to show the simplicity of the proposed approach.

Thin solid film, Substrate, Elasticity, Rotating cylinder