مروری بر عوامل پخت تاخیری-گرمایی رزین اپوکسی

مراجع و منابع این مقاله:

• Komatsu H., Ochiai B., Hino T., and Endo T., Thermally ...
• Koczak M.J., Khatri S.C., Allison J.E., and Bader M.G., Metal-Matrix ...
• Nazarpour-Fard H., Rad-Moghadam K., Shirini F., Beheshty M.H., and Asghari ...
• Yarovsky I. and Evans E., Computer Simulation of Structure and ...
• Jin F.L., Li X., and Park S. J., Synthesis and ...
• Vafayan M., Ghoreishy M.H.R., Abedini H., and Beheshty M.H., Development ...
• Eldin S.H., Maurer J., Peyer R.P., Grieshaber P., and Rime ...
• Wegmann A., Chemical Resistance of Waterborne Epoxy/Amine Coatings, Prog. Org. ...
• Srividhya M., Lakshmi M.S., and Reddy B.S.R., Chemistry of Siloxane ...
• Rubinsztajn M.I. and Rubinsztajn S., Composition Comprising Silicone Epoxy Resin, ...
• Ma S., Liu X., Jiang Y., Tang Z., Zhang C., ...
• Pham H.Q. and Marks M.J., Epoxy Resins, Ullmann’s Encyclopedia of ...
• Kugler S., Kowalczyk K., and Spychaj T., Influence of Synthetic ...
• Shiobara T., Sawada J., Wakao M., Kashiwagi T., Miyagawa N., ...
• Zafar S., Riaz U., and Ahmad S., Water-Borne Melamine-Formaldehyde-Cured Epoxy-Acrylate ...
• Meyer K.J., Hunter G.A., Potts D.L., and Ritter W.L., A ...
• Khalina M., Beheshty M.H., and Salimi A., Preparation and Characterization ...
• Watts J.F., Abel M.L., Perruchot C., Lowe C., Maxted J.T., ...
• Walker J., One Part Epoxy-Based Composition, US Pat. App. 15/547,983, ...
• Perez M.A. and Higgins J.M., High Temperature Stable, One-Part, Curable ...
• Chernack M., Pressure Sensitive Adhesive Composition, US Pat. 4,940,852, 1990. ...
• Endruweit A., Johnson M.S., and Long A.C., Curing of Composite ...
• Kreibich U.T. and Schmid R., Inhomogeneities in Epoxy Resin Networks, ...
• Güthner T. and Hammer B., Curing of Epoxy Resins with ...
• Wu F., Zhou X., and Yu X., Reaction Mechanism, Cure ...
• Hagnauer G.L. and Dunn D.A., Dicyandiamide Analysis and Solubility in ...
• Hayaty M., Beheshty M.H., and Esfandeh M., Cure Kinetics of ...
• Hayaty M., Beheshty M.H., and Esfandeh M., A New Approach ...
• Hayaty M., Beheshty M.H., and Esfandeh M., Isothermal Differential Scanning ...
• Hayaty M., Honarkar H., and Beheshty M.H., Curing Behavior of ...
• Saunders T.F., Levy M.F., and Serino J.F., Mechanism of the ...
• Hesabi M., Salimi A., and Beheshty M.H., Effect of Tertiary ...
• Yamada T., Okumoto T., Ohtani H., and Tsuge S., Characterization ...
• Son P.-N. and Weber C.D., Some Aspects of Monuron-Accelerated Dicyandiamide ...
• Galledari N.A., Beheshty M.H., and Barmar M., Effect of NBR ...
• Jamshidi H., Akbari R., and Beheshty M.H., Toughening of dicyandiamide-cured ...
• Razavi S.M.J., Neisiany R.E., Khorasani S.N., Ramakrishna S., and Berto ...
• Mahnam N., Beheshty M.H., Barmar M., and Shervin M., Modification ...
• Saha  A., Kumar R., Kumar R., and Devakumar C., Development ...
• and Assessment of Green Synthesis of Hydrazides, Indian J. Chem. Section ...
• Tomuta A.M., Ramis X., Ferrando F., and Serra A., The ...
• Zhang B.L., Zhang H.Q., You Y.C., Du Z.J., Ding P.Y., ...
• Chiu Y.S., Liu Y.L., Wei W.L., and Chen W.Y., Using ...
• Ryu J.H., Choi K.S., and Kim W.G., Latent Catalyst Effects ...
• Kim W.G., Yoon H.G., and Lee J.Y., Cure Kinetics of ...
• Hamerton I., Hay J.N., Howlin B.J., Jepson P., and Mortimer ...
• Hamerton I., Hay J.N., Herman H., Howlin B.J., Jepson P., ...
• Roche A.A., Bouchet J., and Bentadjine S., Formation of Epoxy-Diamine/Metal ...
• Arimitsu K., Fuse S., Kudo K., and Furutani M., Imidazole ...
• Ham Y.R., Kim S.H., Shin Y.J., Lee D.H., Yang M., ...
• Kudo K., Furutani M., and Arimitsu K., Imidazole Derivatives with ...
• Kudo K., Fuse S., Furutani M., and Arimitsu K., Imidazole-type ...
• Abraham J. and Subit J., Method and Apparatus for Ultrasound ...
• Sano K., Takaiwa R., and Hirano N., Epoxy Resin Composition, ...
• Dowbenko R., Anderson C.C., and Chang W.H., Imidazole Complexes as ...
• Yin T., Rong M.Z., Zhang M.Q., and Yang G.C., Self-healing ...
• Yin T., Rong M.Z., and Zhang M.Q., Self-healing of Cracks ...
• Zhang M.Q., Rong M.Z., and Yin T., Self-healing Polymers and ...
• Bouillon N., Pascault J.P., and Tighzert L., Epoxy Prepolymers Cured ...
• Bouillon N., Pascault J.P., and Tighzert L., Epoxy Prepolymers Cured ...
• Bouillon N., Pascault J.-P., and Tighzert L., Epoxy Prepolymers Cured ...
• Chabanne P., Tighzert L., Pascault J.P., and Bonnetot B., Epoxy ...
• Smith R.E. and Smith C.H., Epoxy Resin Cure III: Boron ...
• Kim M., Sanda F., and Endo T., Phosphonamidodithioate as a ...
• Ulrich G., Mathes A., Hansen A., and Herzog R., Epoxy ...
• Komatsu H., Hino T., and Endo T., Novel Thermally Latent ...
• Yamamoto T. and Ishidoya M., New Thermosetting Coatings Using Blocked ...
• Nakane Y. and Ishidoya M., New Crosslinking System Using Blocked ...
• Komatsu H., Hino T., and Endo T., Thermal Dissociation Behavior ...
• Komatsu H., Ochiai B., and Endo T., Thermally Latent Reaction ...
• Komatsu H., Ochiai B., Hino T., and Endo T., Model ...
• Okuhira H., Kii T., Ochi M., and Takeyama H., Novel ...
• Holm R.T., Ketimines as Latent Epoxy Curing Agents, J. Paint ...
• Minnich K.E., Rufo M., and Vedage G.A., Ketimines of Benzylated ...
• Wesoły M., Cal K., Ciosek P., and Wróblewski W., Influence ...
• Urbas R., Milošević R., Kašiković N., Pavlović Ž., and Elesini ...
• Silva A.C.M., Moghadam A.D., Singh P., and Rohatgi, P.K., Self-healing ...
• Li H., Cui Y., Wang H., Zhu Y., and Wang ...
• Fan J., Zheng Y., Xie Y., Sun Y., Luan Y., ...
• Jyothi S.S., Seethadevi A., Prabha K.S., Muthuprasanna P., and Pavitra ...
• Balassa L.L., Fanger G.O., and Wurzburg O.B., Microencapsulation in the ...
• Dubey R., Microencapsulation Technology and Applications, Defence Sci. J., 59, ...
• Umer H., Nigam H., Tamboli A.M., and Nainar M.S.M., Microencapsulation: ...
• Akagawa M., and Yasuhara T., Microencapsulated Curing Agent,  US Pat. ...
• Shin M.J., Shin Y.J., and Shin J.S., Latent Imidazole Curing ...
• Cervi G., Pezzin S.H. and Meier M.M., Differential Scanning Calorimetry ...
• Johns R.M., and Schiffman C.W., Room Temperature Storable Prepregs-An Advancement ...
• Shaikh M.Q., Free Volume and Storage Stability of One-component Epoxy ...
• Zhang L. and Wang X., Curing Behavior for Microencapsulated Curing ...
• Fuensanta M., Grau A., Romero-Sánchez M.D., Guillem C., and López-Buendía ...
• Xu H., Fang Z., and Tong L., Effect of Microencapsulated ...
• Ham Y.R., Lee D.H., Kim S.H., Shin Y.J., Yang M., ...
• Lee D.H., Yang M., Kim S.H., Shin M.J., and Shin ...
• Shin M.J., Shin Y.J., Hwang S.W., and Shin J.S., Microencapsulation ...
• Masuko D., Komuro K., Ito M., and Kawashima T., Latent ...
• Xing S., Yang J., Huang Y., Zheng Q., and Zeng ...
• Shin Y.J., Kim M., Hwang S. W., Shin M.J., and ...
• Mozaffari S.M., Beheshty M. H., and Mirabedini S.M., Microencapsulation of ...
• Mozaffari S.M., Beheshty M.H., and Mirabedini S.M., Effect of Processing ...
• Mozaffari S.M., Beheshty M.H., and Mirabedini S.M., Dynamic Mechanical Thermal ...
• Ma A., Zhang Q., Zhang H., Shi Y., and Liu ...
• Ma A.J., Zhang Q.Y., and Shi Y.Q., Study on the ...
• Li C., Tan J., Gu J., Xue Y., Qiao L., ...
• Cao M., Xie P., Jin Z., Zhang Y., Zhang R., ...
• Shin M.J., Kim J.G., and Shin J.S., Microencapsulation of Imidazole ...
• LaLiberte B.R., and Bornstein J., Mechanism of Monuron-Accelerated Dicyandiamide Cure ...
• Decker C., UV-Radiation Curing Chemistry, Pigm. Resin Technol., 30, 278-286, ...
• Sangermano M., Razza N., and Crivello J.V., Cationic UV-curing: Technology ...
• Dixon G.D., Carlson N.W., and Saunders H.E., Solventless UV Dryable ...
• Hayase S., Suzuki S., and Wada M., Photo-Curable Epoxy Resin ...
• Biernath R.W., and Soane D.S., Cure Kinetics of Epoxy Cresol ...
• Morsch S., Lyon S., Greensmith P., Smith S.D., and Gibbon, ...
• Granado L., Kempa S., Bremmert S., Gregoriades L.J., Brüning F., ...
• Bertram J.L., Walker L.L., and Muskopf J.W., Latent Catalysts for ...
• Tyberg C.S., Shih P., Verghese K.N., Loos A.C., Lesko J.J., ...
• Komatsu H., Ochiai B., Hino T., and Endo T., Thermally ...
• Koczak M.J., Khatri S.C., Allison J.E., and Bader M.G., Metal-Matrix ...
• Nazarpour-Fard H., Rad-Moghadam K., Shirini F., Beheshty M.H., and Asghari ...
• Yarovsky I. and Evans E., Computer Simulation of Structure and ...
• Jin F.L., Li X., and Park S. J., Synthesis and ...
• Vafayan M., Ghoreishy M.H.R., Abedini H., and Beheshty M.H., Development ...
• Eldin S.H., Maurer J., Peyer R.P., Grieshaber P., and Rime ...
• Wegmann A., Chemical Resistance of Waterborne Epoxy/Amine Coatings, Prog. Org. ...
• Srividhya M., Lakshmi M.S., and Reddy B.S.R., Chemistry of Siloxane ...
• Rubinsztajn M.I. and Rubinsztajn S., Composition Comprising Silicone Epoxy Resin, ...
• Ma S., Liu X., Jiang Y., Tang Z., Zhang C., ...
• Pham H.Q. and Marks M.J., Epoxy Resins, Ullmann’s Encyclopedia of ...
• Kugler S., Kowalczyk K., and Spychaj T., Influence of Synthetic ...
• Shiobara T., Sawada J., Wakao M., Kashiwagi T., Miyagawa N., ...
• Zafar S., Riaz U., and Ahmad S., Water-Borne Melamine-Formaldehyde-Cured Epoxy-Acrylate ...
• Meyer K.J., Hunter G.A., Potts D.L., and Ritter W.L., A ...
• Khalina M., Beheshty M.H., and Salimi A., Preparation and Characterization ...
• Watts J.F., Abel M.L., Perruchot C., Lowe C., Maxted J.T., ...
• Walker J., One Part Epoxy-Based Composition, US Pat. App. 15/547,983, ...
• Perez M.A. and Higgins J.M., High Temperature Stable, One-Part, Curable ...
• Chernack M., Pressure Sensitive Adhesive Composition, US Pat. 4,940,852, 1990. ...
• Endruweit A., Johnson M.S., and Long A.C., Curing of Composite ...
• Kreibich U.T. and Schmid R., Inhomogeneities in Epoxy Resin Networks, ...
• Güthner T. and Hammer B., Curing of Epoxy Resins with ...
• Wu F., Zhou X., and Yu X., Reaction Mechanism, Cure ...
• Hagnauer G.L. and Dunn D.A., Dicyandiamide Analysis and Solubility in ...
• Hayaty M., Beheshty M.H., and Esfandeh M., Cure Kinetics of ...
• Hayaty M., Beheshty M.H., and Esfandeh M., A New Approach ...
• Hayaty M., Beheshty M.H., and Esfandeh M., Isothermal Differential Scanning ...
• Hayaty M., Honarkar H., and Beheshty M.H., Curing Behavior of ...
• Saunders T.F., Levy M.F., and Serino J.F., Mechanism of the ...
• Hesabi M., Salimi A., and Beheshty M.H., Effect of Tertiary ...
• Yamada T., Okumoto T., Ohtani H., and Tsuge S., Characterization ...
• Son P.-N. and Weber C.D., Some Aspects of Monuron-Accelerated Dicyandiamide ...
• Galledari N.A., Beheshty M.H., and Barmar M., Effect of NBR ...
• Jamshidi H., Akbari R., and Beheshty M.H., Toughening of dicyandiamide-cured ...
• Razavi S.M.J., Neisiany R.E., Khorasani S.N., Ramakrishna S., and Berto ...
• Mahnam N., Beheshty M.H., Barmar M., and Shervin M., Modification ...
• Saha  A., Kumar R., Kumar R., and Devakumar C., Development ...
• and Assessment of Green Synthesis of Hydrazides, Indian J. Chem. Section ...
• Tomuta A.M., Ramis X., Ferrando F., and Serra A., The ...
• Zhang B.L., Zhang H.Q., You Y.C., Du Z.J., Ding P.Y., ...
• Chiu Y.S., Liu Y.L., Wei W.L., and Chen W.Y., Using ...
• Ryu J.H., Choi K.S., and Kim W.G., Latent Catalyst Effects ...
• Kim W.G., Yoon H.G., and Lee J.Y., Cure Kinetics of ...
• Hamerton I., Hay J.N., Howlin B.J., Jepson P., and Mortimer ...
• Hamerton I., Hay J.N., Herman H., Howlin B.J., Jepson P., ...
• Roche A.A., Bouchet J., and Bentadjine S., Formation of Epoxy-Diamine/Metal ...
• Arimitsu K., Fuse S., Kudo K., and Furutani M., Imidazole ...
• Ham Y.R., Kim S.H., Shin Y.J., Lee D.H., Yang M., ...
• Kudo K., Furutani M., and Arimitsu K., Imidazole Derivatives with ...
• Kudo K., Fuse S., Furutani M., and Arimitsu K., Imidazole-type ...
• Abraham J. and Subit J., Method and Apparatus for Ultrasound ...
• Sano K., Takaiwa R., and Hirano N., Epoxy Resin Composition, ...
• Dowbenko R., Anderson C.C., and Chang W.H., Imidazole Complexes as ...
• Yin T., Rong M.Z., Zhang M.Q., and Yang G.C., Self-healing ...
• Yin T., Rong M.Z., and Zhang M.Q., Self-healing of Cracks ...
• Zhang M.Q., Rong M.Z., and Yin T., Self-healing Polymers and ...
• Bouillon N., Pascault J.P., and Tighzert L., Epoxy Prepolymers Cured ...
• Bouillon N., Pascault J.P., and Tighzert L., Epoxy Prepolymers Cured ...
• Bouillon N., Pascault J.-P., and Tighzert L., Epoxy Prepolymers Cured ...
• Chabanne P., Tighzert L., Pascault J.P., and Bonnetot B., Epoxy ...
• Smith R.E. and Smith C.H., Epoxy Resin Cure III: Boron ...
• Kim M., Sanda F., and Endo T., Phosphonamidodithioate as a ...
• Ulrich G., Mathes A., Hansen A., and Herzog R., Epoxy ...
• Komatsu H., Hino T., and Endo T., Novel Thermally Latent ...
• Yamamoto T. and Ishidoya M., New Thermosetting Coatings Using Blocked ...
• Nakane Y. and Ishidoya M., New Crosslinking System Using Blocked ...
• Komatsu H., Hino T., and Endo T., Thermal Dissociation Behavior ...
• Komatsu H., Ochiai B., and Endo T., Thermally Latent Reaction ...
• Komatsu H., Ochiai B., Hino T., and Endo T., Model ...
• Okuhira H., Kii T., Ochi M., and Takeyama H., Novel ...
• Holm R.T., Ketimines as Latent Epoxy Curing Agents, J. Paint ...
• Minnich K.E., Rufo M., and Vedage G.A., Ketimines of Benzylated ...
• Wesoły M., Cal K., Ciosek P., and Wróblewski W., Influence ...
• Urbas R., Milošević R., Kašiković N., Pavlović Ž., and Elesini ...
• Silva A.C.M., Moghadam A.D., Singh P., and Rohatgi, P.K., Self-healing ...
• Li H., Cui Y., Wang H., Zhu Y., and Wang ...
• Fan J., Zheng Y., Xie Y., Sun Y., Luan Y., ...
• Jyothi S.S., Seethadevi A., Prabha K.S., Muthuprasanna P., and Pavitra ...
• Balassa L.L., Fanger G.O., and Wurzburg O.B., Microencapsulation in the ...
• Dubey R., Microencapsulation Technology and Applications, Defence Sci. J., 59, ...
• Umer H., Nigam H., Tamboli A.M., and Nainar M.S.M., Microencapsulation: ...
• Akagawa M., and Yasuhara T., Microencapsulated Curing Agent,  US Pat. ...
• Shin M.J., Shin Y.J., and Shin J.S., Latent Imidazole Curing ...
• Cervi G., Pezzin S.H. and Meier M.M., Differential Scanning Calorimetry ...
• Johns R.M., and Schiffman C.W., Room Temperature Storable Prepregs-An Advancement ...
• Shaikh M.Q., Free Volume and Storage Stability of One-component Epoxy ...
• Zhang L. and Wang X., Curing Behavior for Microencapsulated Curing ...
• Fuensanta M., Grau A., Romero-Sánchez M.D., Guillem C., and López-Buendía ...
• Xu H., Fang Z., and Tong L., Effect of Microencapsulated ...
• Ham Y.R., Lee D.H., Kim S.H., Shin Y.J., Yang M., ...
• Lee D.H., Yang M., Kim S.H., Shin M.J., and Shin ...
• Shin M.J., Shin Y.J., Hwang S.W., and Shin J.S., Microencapsulation ...
• Masuko D., Komuro K., Ito M., and Kawashima T., Latent ...
• Xing S., Yang J., Huang Y., Zheng Q., and Zeng ...
• Shin Y.J., Kim M., Hwang S. W., Shin M.J., and ...
• Mozaffari S.M., Beheshty M. H., and Mirabedini S.M., Microencapsulation of ...
• Mozaffari S.M., Beheshty M.H., and Mirabedini S.M., Effect of Processing ...
• Mozaffari S.M., Beheshty M.H., and Mirabedini S.M., Dynamic Mechanical Thermal ...
• Ma A., Zhang Q., Zhang H., Shi Y., and Liu ...
• Ma A.J., Zhang Q.Y., and Shi Y.Q., Study on the ...
• Li C., Tan J., Gu J., Xue Y., Qiao L., ...
• Cao M., Xie P., Jin Z., Zhang Y., Zhang R., ...
• Shin M.J., Kim J.G., and Shin J.S., Microencapsulation of Imidazole ...
• LaLiberte B.R., and Bornstein J., Mechanism of Monuron-Accelerated Dicyandiamide Cure ...
• Decker C., UV-Radiation Curing Chemistry, Pigm. Resin Technol., 30, 278-286, ...
• Sangermano M., Razza N., and Crivello J.V., Cationic UV-curing: Technology ...
• Dixon G.D., Carlson N.W., and Saunders H.E., Solventless UV Dryable ...
• Hayase S., Suzuki S., and Wada M., Photo-Curable Epoxy Resin ...
• Biernath R.W., and Soane D.S., Cure Kinetics of Epoxy Cresol ...
• Morsch S., Lyon S., Greensmith P., Smith S.D., and Gibbon, ...
• Granado L., Kempa S., Bremmert S., Gregoriades L.J., Brüning F., ...
• Bertram J.L., Walker L.L., and Muskopf J.W., Latent Catalysts for ...
• Tyberg C.S., Shih P., Verghese K.N., Loos A.C., Lesko J.J., ...
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