Influence of minor Chromium addition on thermal properties and wetting characteristics of Sn-۰.۸Cu-۱.۸Bisolder alloy on Cu substrate

The exemption clause for using the Lead-bearing solders in automobile parts was expired in ۲۰۱۴.Therefore, a new suitable Lead-free solder should be produced for this industry. One of the importantparts of an automobile is the Engine Control Unit (ECU) which exposed to high temperatures andvibrations. In this research, the novel solders are investigated for propose of ECU condition. The Sn-Cu solder modified by Bi and minor Cr addition and the thermal properties and wettability wereexamined. The thermal properties were examined at Nitrogen atmosphere with ۳۰۰°C as maximumtemperature and the wettability of the solder alloys on the Cu substrate are discussed. It was confirmedthat the minor addition of Cr enhances the thermal properties and wettability without significantlydecreasing the melting temperature.