Fabrication of Ni-Cu with Hierarchical Structure on Cu substrate via Electrodeposition Method and Investigation the Microstructure and Corrosion Resistance

The study of superfluid levels due to the importance of these levels in many applications has been considered. In this study, nickel-copper alloy coatings were created using a two-step electrochemical deposition method-the surface energy reduction and microstructure and corrosion resistance were investigated. Surface morphology was investigated using scanning electron microscopy and XRD for field publishing and fuzzy structure. Corrosion resistance was investigated using potentiodynamic polarization method as well as electrochemical impedance spectroscopy. The results of this study showed that by increasing the concentration of Modidium crystal in the coating bath, the nanostructured coating was obtained and at a concentration of ۲۰۰ grams per liter, a hieratic hierarchy coating was obtained. XRD data showed that only the nickel phase was created and a solid solution was created by the entry of copper atoms into the structure. Corrosion behavior studies showed that with the formation of coating, the corrosion density decreased from ۶.۲ to ۰.۱۲ mA/cm۲, and corrosion potential from-۲۷۳ to -۱۷۱ also decreased. The reason for this was the capture of trapped air in the coating, thereby preventing the entry of corrosive ions into the substrate as well as the Laplace pressure.