Workability Study in Near- Peritectic Sn-5%Sb Lead-Free Solder Alloy Processed By Severe Plastic Deformation

Severe Plastic Deformation (SPD) of Sn-5Sb solder alloy was carried out under different deformation conditions including the temperature range of 298, 330, 360, 400 K and die designs in the present research. An experimentally validated finite element method (FEM) is applied to propose a simulation strategy for predicting the workability in equal channel angular pressing (ECAP) of the alloy. Different parameters such as die angles (angle between the channels and the outer corner angle), pressing temperature and the die outlet channel geometry were studied using Finite Element Method (FEM) simulation. It was found that, by increasing both die and outer corner angle, the imposed strain rises and in the counter, through increasing the temperature, the portion of low-angle grain boundaries and recovery kinetics rate increased. Finally, presence of choke angle imposes compressive stress as well as causing an increase in the pressing pressure.