Design of Modular Fault Current Limiter to Avoid Reliability Degradation
محل انتشار: چهارمین کنفرانس بین المللی مهندسی قابلیت اطمینان
سال انتشار: 1395
نوع سند: مقاله کنفرانسی
زبان: انگلیسی
مشاهده: 464
فایل این مقاله در 8 صفحه با فرمت PDF قابل دریافت می باشد
- صدور گواهی نمایه سازی
- من نویسنده این مقاله هستم
استخراج به نرم افزارهای پژوهشی:
شناسه ملی سند علمی:
RELI04_054
تاریخ نمایه سازی: 1 مرداد 1397
چکیده مقاله:
With the short circuit level increase in power grids, thereis a need to increase rating of switch type fault currentlimiters (STFCLs), therefore, modularization of STFCLsis inevitable. This paper presents a comparativereliability analysis between the modular and non-modularSTFCL topologies. It is demonstrated that modulardesign causes a considerable reduction in reliability. Theaim of the presented study is to increase the reliability ofmodular fault current limiters using thermal management.The failure rate of STFCL module and junctiontemperature calculation is developed. The mean time tofailure (MTTF) is used as the reliability metric. MTTFsof two topologies are calculated and compared. It isdemonstrated that reliability of STFCL depends on thejunction temperature of the semiconductor switches inthe steady state, that it can be controlled by the thermalresistance of the heat sink. Ranges of the junctiontemperature and thermal resistance in which the modularconfiguration is more reliable are formulated. Thennumerical studies are presented to verify the efficacy ofthe proposed approach.
کلیدواژه ها:
نویسندگان
M Farhadi
Faculty of Electrical and Computer Engineering, University of Tabriz
V Shahi-Kalalagh
Faculty of Electrical and Computer Engineering, University of Tabriz
M Mohammadi
Faculty of New Science and Technology, University of Tehran
M Abapour
Faculty of Electrical and Computer Engineering, University of Tabriz